JPH0368542B2 - - Google Patents
Info
- Publication number
- JPH0368542B2 JPH0368542B2 JP55501795A JP50179580A JPH0368542B2 JP H0368542 B2 JPH0368542 B2 JP H0368542B2 JP 55501795 A JP55501795 A JP 55501795A JP 50179580 A JP50179580 A JP 50179580A JP H0368542 B2 JPH0368542 B2 JP H0368542B2
- Authority
- JP
- Japan
- Prior art keywords
- gate
- erase
- floating gate
- voltage
- floating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007667 floating Methods 0.000 description 47
- 239000000758 substrate Substances 0.000 description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000005669 field effect Effects 0.000 description 5
- 101100521334 Mus musculus Prom1 gene Proteins 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000005641 tunneling Effects 0.000 description 2
- 241001168730 Simo Species 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
- H10D30/686—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection using hot carriers produced by avalanche breakdown of PN junctions, e.g. floating gate avalanche injection MOS [FAMOS]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
- Static Random-Access Memory (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/130,853 US4331968A (en) | 1980-03-17 | 1980-03-17 | Three layer floating gate memory transistor with erase gate over field oxide region |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57500398A JPS57500398A (en]) | 1982-03-04 |
JPH0368542B2 true JPH0368542B2 (en]) | 1991-10-28 |
Family
ID=22446666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP55501795A Expired JPH0368542B2 (en]) | 1980-03-17 | 1980-05-22 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4331968A (en]) |
EP (1) | EP0037201B1 (en]) |
JP (1) | JPH0368542B2 (en]) |
CA (1) | CA1166353A (en]) |
DE (1) | DE3175451D1 (en]) |
GB (1) | GB2085228B (en]) |
WO (1) | WO1981002810A1 (en]) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4498095A (en) * | 1978-05-02 | 1985-02-05 | International Business Machines Corporation | Semiconductor structure with improved isolation between two layers of polycrystalline silicon |
US4561004A (en) * | 1979-10-26 | 1985-12-24 | Texas Instruments | High density, electrically erasable, floating gate memory cell |
DE3175125D1 (en) * | 1980-11-20 | 1986-09-18 | Toshiba Kk | Semiconductor memory device and method for manufacturing the same |
DE3174417D1 (en) * | 1980-12-08 | 1986-05-22 | Toshiba Kk | Semiconductor memory device |
US4479203A (en) * | 1981-11-16 | 1984-10-23 | Motorola, Inc. | Electrically erasable programmable read only memory cell |
FR2517864A1 (fr) * | 1981-12-07 | 1983-06-10 | Telecommunications Sa | Dispositif d'enregistrement et de lecture d'images |
US4545035A (en) * | 1982-07-20 | 1985-10-01 | Mostek Corporation | Dynamic RAM with nonvolatile shadow memory |
US4527258A (en) * | 1982-09-30 | 1985-07-02 | Mostek Corporation | E2 PROM having bulk storage |
US5268319A (en) * | 1988-06-08 | 1993-12-07 | Eliyahou Harari | Highly compact EPROM and flash EEPROM devices |
US5095344A (en) * | 1988-06-08 | 1992-03-10 | Eliyahou Harari | Highly compact eprom and flash eeprom devices |
US5168465A (en) * | 1988-06-08 | 1992-12-01 | Eliyahou Harari | Highly compact EPROM and flash EEPROM devices |
US4962326B1 (en) * | 1988-07-22 | 1993-11-16 | Micron Technology, Inc. | Reduced latchup in precharging i/o lines to sense amp signal levels |
KR940006094B1 (ko) * | 1989-08-17 | 1994-07-06 | 삼성전자 주식회사 | 불휘발성 반도체 기억장치 및 그 제조방법 |
US5343063A (en) * | 1990-12-18 | 1994-08-30 | Sundisk Corporation | Dense vertical programmable read only memory cell structure and processes for making them |
US5512505A (en) * | 1990-12-18 | 1996-04-30 | Sandisk Corporation | Method of making dense vertical programmable read only memory cell structure |
US7071060B1 (en) | 1996-02-28 | 2006-07-04 | Sandisk Corporation | EEPROM with split gate source side infection with sidewall spacers |
US6222762B1 (en) | 1992-01-14 | 2001-04-24 | Sandisk Corporation | Multi-state memory |
US5712180A (en) * | 1992-01-14 | 1998-01-27 | Sundisk Corporation | EEPROM with split gate source side injection |
US5313421A (en) * | 1992-01-14 | 1994-05-17 | Sundisk Corporation | EEPROM with split gate source side injection |
KR100192430B1 (ko) * | 1995-08-21 | 1999-06-15 | 구본준 | 비휘발성 메모리 및 이 비휘발성 메모리를 프로그램하는 방법 |
KR0172831B1 (ko) * | 1995-09-18 | 1999-03-30 | 문정환 | 비휘발성 메모리를 프로그램하는 방법 |
KR100192476B1 (ko) * | 1996-06-26 | 1999-06-15 | 구본준 | 다중 비트 메모리 셀의 데이타 센싱장치 및 방법 |
KR100215883B1 (ko) * | 1996-09-02 | 1999-08-16 | 구본준 | 플래쉬 메모리 소자 및 그 제조방법 |
KR100226746B1 (ko) * | 1996-12-30 | 1999-10-15 | 구본준 | 다중비트셀의데이타센싱장치및방법 |
KR100244271B1 (ko) * | 1997-05-06 | 2000-02-01 | 김영환 | 반도체소자 구조 및 제조방법 |
FI981301A0 (fi) | 1998-06-08 | 1998-06-08 | Valtion Teknillinen | Prosessivaihtelujen eliminointimenetelmä u-MOSFET-rakenteissa |
US7541638B2 (en) | 2005-02-28 | 2009-06-02 | Skymedi Corporation | Symmetrical and self-aligned non-volatile memory structure |
US7439133B2 (en) * | 2006-01-02 | 2008-10-21 | Skymedi Corporation | Memory structure and method of manufacturing a memory array |
US7508028B2 (en) * | 2006-10-26 | 2009-03-24 | Episil Technologies Inc. | Non-volatile memory |
US7450424B2 (en) * | 2007-01-31 | 2008-11-11 | Skymedi Corporation | Method for reading a memory array with a non-volatile memory structure |
CN108695332B (zh) * | 2018-05-18 | 2021-05-07 | 上海华虹宏力半导体制造有限公司 | 分栅式闪存及其形成方法、控制方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3755721A (en) * | 1970-06-15 | 1973-08-28 | Intel Corp | Floating gate solid state storage device and method for charging and discharging same |
US3996657A (en) * | 1974-12-30 | 1976-12-14 | Intel Corporation | Double polycrystalline silicon gate memory device |
NL7500550A (nl) * | 1975-01-17 | 1976-07-20 | Philips Nv | Halfgeleider-geheugeninrichting. |
JPS52106275A (en) * | 1976-03-03 | 1977-09-06 | Nec Corp | Floating type nonvoltile semiconductor memory element |
US4115914A (en) * | 1976-03-26 | 1978-09-26 | Hughes Aircraft Company | Electrically erasable non-volatile semiconductor memory |
FR2354152A1 (fr) * | 1976-06-08 | 1978-01-06 | Michelin & Cie | Procede pour fabriquer par laminage un ruban en acier, et ruban resultant de ce procede |
US4119995A (en) * | 1976-08-23 | 1978-10-10 | Intel Corporation | Electrically programmable and electrically erasable MOS memory cell |
US4099196A (en) * | 1977-06-29 | 1978-07-04 | Intel Corporation | Triple layer polysilicon cell |
US4203158A (en) * | 1978-02-24 | 1980-05-13 | Intel Corporation | Electrically programmable and erasable MOS floating gate memory device employing tunneling and method of fabricating same |
JPS5513901A (en) * | 1978-07-17 | 1980-01-31 | Hitachi Ltd | Fixed memory of semiconductor |
DE2908796C3 (de) * | 1979-03-07 | 1982-04-01 | Siemens AG, 1000 Berlin und 8000 München | Umprogrammierbarer Halbleiter-Festwertspeicher vom Floating-Gate-Typ |
-
1980
- 1980-03-17 US US06/130,853 patent/US4331968A/en not_active Expired - Lifetime
- 1980-05-22 WO PCT/US1980/000654 patent/WO1981002810A1/en unknown
- 1980-05-22 GB GB8135603A patent/GB2085228B/en not_active Expired
- 1980-05-22 JP JP55501795A patent/JPH0368542B2/ja not_active Expired
-
1981
- 1981-03-16 EP EP81301080A patent/EP0037201B1/en not_active Expired
- 1981-03-16 DE DE8181301080T patent/DE3175451D1/de not_active Expired
- 1981-03-16 CA CA000373061A patent/CA1166353A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0037201B1 (en) | 1986-10-08 |
DE3175451D1 (en) | 1986-11-13 |
GB2085228B (en) | 1984-05-23 |
GB2085228A (en) | 1982-04-21 |
JPS57500398A (en]) | 1982-03-04 |
WO1981002810A1 (en) | 1981-10-01 |
US4331968A (en) | 1982-05-25 |
CA1166353A (en) | 1984-04-24 |
EP0037201A3 (en) | 1983-05-18 |
EP0037201A2 (en) | 1981-10-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0368542B2 (en]) | ||
EP0676811B1 (en) | EEPROM cell with isolation transistor and methods for making and operating the same | |
US5544103A (en) | Compact page-erasable eeprom non-volatile memory | |
EP0051158B1 (en) | Electrically alterable double dense memory | |
US4412311A (en) | Storage cell for nonvolatile electrically alterable memory | |
KR100207504B1 (ko) | 불휘발성 메모리소자, 그 제조방법 및 구동방법 | |
US6297097B1 (en) | Method for forming a semiconductor memory device with increased coupling ratio | |
US4612212A (en) | Method for manufacturing E2 PROM | |
JP2710521B2 (ja) | 反転層を含む半導体メモリ・セルおよびメモリ・アレイ | |
US4425631A (en) | Non-volatile programmable integrated semiconductor memory cell | |
US4228527A (en) | Electrically reprogrammable non volatile memory | |
US4404577A (en) | Electrically alterable read only memory cell | |
JPS6112396B2 (en]) | ||
US5053842A (en) | Semiconductor nonvolatile memory | |
KR940005898B1 (ko) | 불휘발성 반도체장치 | |
US4590503A (en) | Electrically erasable programmable read only memory | |
US4486859A (en) | Electrically alterable read-only storage cell and method of operating same | |
JPS59500342A (ja) | 電気的に改変可能の不揮発性浮動ゲ−ト記憶装置 | |
JPH01278781A (ja) | 不揮発性半導体記憶装置 | |
JPS62183161A (ja) | 半導体集積回路装置 | |
JP2797466B2 (ja) | 不揮発性半導体記憶装置 | |
KR100521430B1 (ko) | 플래쉬 메모리 및 이를 이용한 프로그램 방법 | |
SU881860A1 (ru) | Элемент пам ти | |
JP3104978B2 (ja) | 不揮発性半導体記憶装置の制御方法 | |
JPH01211979A (ja) | 不揮発性半導体メモリ |